PANELS
TRACE & SPACE
  • Max. Panel Size: 21" x 23" (Manual), 20" x 24" (Automatic)
  • Min. Panel Border: 0.5"
  • Trace/Space (External, 1 oz.) – 4/4 mil
  • Trace/Space (Internal, 1 oz.) – 4/4 mil
  • External 2 oz. – 5/5 mil
  • External 3 oz. – 8/8 mil
  • Internal 2 oz. – 4/5 mil
MECHANICAL DRILLING VIAS
  • Min. Finished Hole Size – 8 mil
  • Min. Drill Size – 10 mil
  • Aspect Ratio – 8:1
  • Tapered Hole
  • Buried Vias
  • Blind Vias
  • Controlled Depth Drill
  • Micro Via Min. 4mil
  • Laser Type – CO2
  • Micro Via Capture Pad/Ablated Hole
  • Micro Via Materials & Dielectric (Die.) – RCC/PP
  • Controlled Impedance Rambus/Single Ended Differential
BOARD PROPERTIES FINISHES
  • Max. Layer Count – 20
  • Min. Core Thickness – 2 mil
  • Min. Thickness – 0.010"
  • Max. Thickness – 0.250"
  • Selective Soft Gold (MCM Au: Max. 40u")
  • Selective Hard Gold (SIMM Au: Max. 50u")
  • Immersion Gold (1~10u")
  • HASL
  • OSP (Entek CU106A, CU106AX)
  • Immersion Tin
  • Immersion Silver
  • Carbon Ink
  • Other – Peelable Ink
MATERIALS PRIMARY MATERIAL SUPPLIERS FOR LAMINATE & REPREG
  • Multifunctional FR-4
  • Bismalemide Triazine (BT)
  • Polyimide
  • CAF Resistance FR4
  • Flex
  • Getek
  • Rogers 4350
  • Rogers 4003
  • Isola FR408
  • TG 150C FR4
  • ITEQ IT150TC
  • Halogen Free
  • Nan Ya
  • Isola
  • PolyClad
  • Elite
  • ITEQ
  • TUC
TESTING CAPABILITY SOLDERMASK
  • Flying Probe
  • Universal & Dedicate
  • AOI
  • LPI Solder Mask
  • Solder Dam Min. – 3 mil
  • LPI Solder Mask Halogen Free
  • Green, Red, Blue, Yellow Colors Available
PROCESS CAPABILITIES QUALITY ASSURANCE
  • Plated over Via in Pad
  • Panel Plate
  • Pattern Plate
  • FR4 with Getek
  • Through Hole Max. Aspect Ratio – 8:1
  • Blind Hole Max. Aspect Ratio – 0.7:1
  • Min. Copper Thickness in Hole – 0.7mil
  • Sequential Lamination
  • Rigid-Flex/Flex Circuits
  • ISO 9001
  • QS 9000
HEAVY COPPER CAPABILITY DATA FORMATS
  • Copper Weight (Inner layer) – 2 ~ 6 oz.
  • GERBER
  • ODB++
  • GENESIS
BACKPLANE CAPABILITY  
  • Max. Board Size – 20" x 24", 21" x 23"
  • Impedance Control Tolerance – +/- 5 ~ 8%
 

 

 

 

 

 

Rigid PCB Process Capability